Inari Amertron Berhad

Inari Amertron Berhad, established in Petaling Jaya, Malaysia in 2006, operates as an investment holding company with a core focus on providing electronic manufacturing services (EMS) and outsourced semiconductor assembly and testing (OSAT). The company’s international reach spans Malaysia, Singapore, the United States, China, and the Philippines. Specializing in radio frequency (RF), fiber-optic transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies, Inari offers a wide array of services. These include advanced wafer processing, such as bumping, probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. For fiber optic chips, it provides fabrication and certification, encompassing wafer scribe and cleave, bar alignment, demount-load fixtures, facet coating, and chip-on-carrier solutions. The company also excels in sophisticated system-in-package (SiP) assembly and testing. This involves fine-pitch surface mount technology (SMT), high-speed and high-accuracy flip-chip placement, in-line post-vision, molding underfill, post-mold oxide plating, and final testing for advanced communication chips. Additional services cover new product introduction (NPI), failure analysis, design and characterization for sensor and IC packages, process customization, product testing, box build, and direct-to-end-customer dropshipping. Furthermore, Inari Amertron manufactures electronic optical fiber and optoelectronic devices, communication chips, and prepares dies. It undertakes the manufacturing, assembly, and testing of various optoelectronic and sensor components, modules, and systems. The company also designs and develops fiber optic products, alongside designing, assembling, and supplying both standard and customized semiconductor manufacturing process tools and their parts. Its portfolio also includes property investments.

CEO: Kean Cheong Lau - https://www.inari-amertron.com